Abstract :
The following topics are dealt with: test and measurement; reliable system design; system frameworks and tools; thermal and power in 3D ICs; low power communication circuits; process-induced variability & hot spot detection; emerging topics in EDA; design & analysis of emerging devices; variation-aware design methodologies; physical design; robust SRAM design; 3D effects on package co-design; advanced analysis & characterization for sub-micron design; power-aware design; circuit-level variability & manufacturability; verification & silicon debug; challenges & opportunities in new technologies; and energy-aware system design.
Keywords :
SRAM chips; electronic design automation; electronic engineering; electronics industry; electronics packaging; reliability; three-dimensional integrated circuits; 3D IC; 3D effects; circuit-level manufacturability; circuit-level variability; emerging devices; energy-aware system design; hot spot detection; low power communication circuit; package codesign; power-aware design; process-induced variability; quality electronic design; reliable system design; robust SRAM design; silicon debug; submicron design; system frameworks; variation-aware design methodology;
Conference_Titel :
Quality Electronic Design (ISQED), 2012 13th International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4673-1034-5
DOI :
10.1109/ISQED.2012.6187583
