DocumentCode
1893757
Title
Effect of composition on the low-cycle fatigue of Pb alloy solder joints
Author
Guo, Z. ; Hacke, P. ; Sprecher, A.F. ; Conrad, H.
Author_Institution
Dept. of Mater. Sci. & Eng., North Carolina State Univ., Raleigh, NC, USA
fYear
1990
fDate
20-23 May 1990
Firstpage
496
Abstract
Low-cycle fatigue tests in shear at 300 K (total strain control, reversed ramp cycling at a frequency of 0.1 Hz) were performed on solder joints of Pb-Sn alloys with 10-75 wt.% Sn, a 36Pb-62Sn-2Ag alloy, and a 50Pb-50In alloy. The fatigue results (based on 95% lead-drop failure criterion) followed the Coffin-Manson (C-M) equation with a C-M exponent q ≈0.4 which decreased slightly with volume fraction of the β-phase (f βv) and a C-M constant C ≈1 which decreased slightly with F βv. Plots of the decrease in load and increase in plastic strain range with cycling exhibited stage-I behavior only for F βv>0.7 and total strain range <0.1. The number of cycles required for the termination of stage I increased significantly when F βv was greater than this amount. No significant effect of 2-wt.% Ag on the various mechanical properties could be detected other than would occur from the addition of an equivalent amount of Sn. The addition of 50-wt.% In to Pb had no appreciable effect on the monotonic or cyclic stress-strain behavior, nor on the C-M exponent; it, however, produced a three-fold increase in the C-M constant, thereby giving superior fatigue resistance over the Pb-Sn (Ag) alloys for the 95% load-drop criterion. However, no beneficial effect of the In occurred when the termination of stage I was taken as the failure criterion, suggesting that In retards crack growth but not initiation. The effects of alloy content on the fatigue behavior of the present alloys are in qualitative agreement with theoretical considerations
Keywords
fatigue testing; lead alloys; soldering; 0.1 Hz; 300 K; 36Pb-62Sn-2Ag alloy; 50Pb-50In alloy; Coffin-Manson constant; Coffin-Manson equation; Coffin-Manson exponent; Pb alloy solder joints; Pb-In alloys; Pb-Sn alloys; Pb-Sn-Ag alloys; composition effects; crack growth; crack initiation; cyclic stress-strain behavior; decrease in load; fatigue behavior; fatigue resistance; frequency; lead-drop failure criterion; low cycle fatigue tests; mechanical properties; monotonic stress-strain behaviour; number of cycles; plastic strain range; reversed ramp cycling; solder alloys; total strain control; Capacitive sensors; Equations; Fatigue; Frequency; Lead; Performance evaluation; Soldering; Strain control; Testing; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/ECTC.1990.122234
Filename
122234
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