• DocumentCode
    1893923
  • Title

    AlGaN/GaN HEMTs for energy efficient systems

  • Author

    Gaska, R. ; Simin, G. ; Shur, M.

  • Author_Institution
    Electron. Technol., Inc., Columbia, SC, USA
  • fYear
    2013
  • fDate
    21-23 May 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Materials properties of nitride semiconductors make them superior candidates for power electronics applications. Materials quality, strongly non-uniform field distribution, variations of parameters from device to device, and reliability problems have to be improved or resolved. New designs, especially suitable to nitride devices, include the use of Low Conducting Layers, “composite channel structures, and novel contacts. All these improvement still have to be validated and improved to make the dream of nitride power electronics to be competitive with Si and SiC power transistors.
  • Keywords
    III-V semiconductors; power HEMT; power consumption; wide band gap semiconductors; AlGaN-GaN; HEMT; breakdown voltage off state; energy efficient systems; gallium nitride transistors; heterostructure field effect transistors; high electron mobility transistor; nitride power transistors; nitride semiconductors; power electronics applications; transistor switch on-resistance; Aluminum gallium nitride; Electric fields; Gallium nitride; HEMTs; Logic gates; MODFETs; Materials; GaN MISHFETs; III-N HEMTs; SPICE; breakdown voltage; patch antenna;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energytech, 2013 IEEE
  • Conference_Location
    Cleveland, OH
  • Type

    conf

  • DOI
    10.1109/EnergyTech.2013.6645294
  • Filename
    6645294