DocumentCode
1893923
Title
AlGaN/GaN HEMTs for energy efficient systems
Author
Gaska, R. ; Simin, G. ; Shur, M.
Author_Institution
Electron. Technol., Inc., Columbia, SC, USA
fYear
2013
fDate
21-23 May 2013
Firstpage
1
Lastpage
6
Abstract
Materials properties of nitride semiconductors make them superior candidates for power electronics applications. Materials quality, strongly non-uniform field distribution, variations of parameters from device to device, and reliability problems have to be improved or resolved. New designs, especially suitable to nitride devices, include the use of Low Conducting Layers, “composite channel structures, and novel contacts. All these improvement still have to be validated and improved to make the dream of nitride power electronics to be competitive with Si and SiC power transistors.
Keywords
III-V semiconductors; power HEMT; power consumption; wide band gap semiconductors; AlGaN-GaN; HEMT; breakdown voltage off state; energy efficient systems; gallium nitride transistors; heterostructure field effect transistors; high electron mobility transistor; nitride power transistors; nitride semiconductors; power electronics applications; transistor switch on-resistance; Aluminum gallium nitride; Electric fields; Gallium nitride; HEMTs; Logic gates; MODFETs; Materials; GaN MISHFETs; III-N HEMTs; SPICE; breakdown voltage; patch antenna;
fLanguage
English
Publisher
ieee
Conference_Titel
Energytech, 2013 IEEE
Conference_Location
Cleveland, OH
Type
conf
DOI
10.1109/EnergyTech.2013.6645294
Filename
6645294
Link To Document