Title :
Applying the TQM method of process characterization to Harris Semiconductor´s Spice model development and support
Author :
Haycock, Thomas L.
Author_Institution :
Harris Semiconductor, Melbourne, FL, USA
Abstract :
Improving product-to-market (PTM) cycle time for new products is recognized as a critical success factor in achieving Harris Corporation´s quality first goals. One key component in reducing PTM times is the application and improvement of CAD tools and their related models, which are the basis for circuit simulation and verification. As a means to improve PTM times, the total quality management (TQM) methodology of process characterization is applied to Spice model development and support activities. Process characterization is the orderly assessment of current operational procedures and relationships (state), definition of the desired state, and development of a plan that identifies steps for evolving to the desired state. The mechanics of how process characterization is applied to a critical industrial problem are explored, together with results achieved at the end of the three-month process characterization. A cross-functional team representing design systems, technology development, product lines, and manufacturing has been established to implement the recommendations
Keywords :
DP management; SPICE; circuit CAD; digital simulation; integrated circuit manufacture; quality control; semiconductor process modelling; CAD tools; Harris semiconductor; PTM times; TQM method; circuit simulation; circuit verification; industrial problem; manufacturing; process characterization; product-to-market cycle time; technology development; total quality management methodology; Circuit simulation; Continuous improvement; Customer satisfaction; Industrial relations; Manufacturing industries; Manufacturing processes; Productivity; Quality function deployment; SPICE; Total quality management;
Conference_Titel :
University/Government/Industry Microelectronics Symposium, 1993., Proceedings of the Tenth Biennial
Conference_Location :
Research Triangle Park, NC
Print_ISBN :
0-7803-0990-1
DOI :
10.1109/UGIM.1993.297035