• DocumentCode
    1894041
  • Title

    Fabrication of thin-reliable multichip modules

  • Author

    Hess, Glenn T. ; Sanders, Thomas J. ; Miller, Roy ; Gsteiger, Kurt

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Florida Inst. of Technol., Melbourne, FL, USA
  • fYear
    1993
  • fDate
    18-19 May 1993
  • Firstpage
    56
  • Lastpage
    58
  • Abstract
    The fabrication of thin, reliable multichip modules has been demonstrated by Florida Institute of Technology. This involved developing encapsulation techniques to build multichip modules (MCMs) with a thickness less than 0.05 inches. The ultimate goal of these encapsulation techniques is to provide hermetic performance at a low cost while meeting specific environmental conditions
  • Keywords
    circuit reliability; encapsulation; environmental testing; integrated circuit manufacture; multichip modules; Finesse software; MCM; encapsulation techniques; environmental test; hermetic performance; layout design; reliability; thin multichip module fabrication; Bonding; Costs; Etching; Fabrication; Gold; Multichip modules; Packaging; Substrates; Testing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    University/Government/Industry Microelectronics Symposium, 1993., Proceedings of the Tenth Biennial
  • Conference_Location
    Research Triangle Park, NC
  • ISSN
    0749-6877
  • Print_ISBN
    0-7803-0990-1
  • Type

    conf

  • DOI
    10.1109/UGIM.1993.297037
  • Filename
    297037
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1894041