Title :
Optical data link assembly for 360 µm diameter IVUS on guidewire imaging devices
Author :
Stoute, Ronald ; Louwerse, Marcus C. ; van Rens, Jeannet ; Henneken, Vincent A. ; Dekker, Ronald
Author_Institution :
Dept. of Microelectron., Delft Univ. of Technol., Delft, Netherlands
Abstract :
We propose a novel concept for a high-speed optical data link in 360 μm diameter cardiovascular interventional imaging guidewires. The concept is based on the recently introduced Flex-to-Rigid (F2R) technology platform. This technology allows for new intravascular imaging devices with the required small form-factor. We extended the existing F2R technology with a new optical data link assembly method to enable high speed data communication from the distal tip of the catheter to the proximal side. In this method, the fiber is aligned by inserting it into a through-wafer hole directly underneath the flip-chipped Vertical-Cavity-Surface Emitting Laser (VCSEL). Therefore, the total diameter of the optical data link is primarily limited by the size of the VCSEL. A wafer-scale demonstrator setup was fabricated with a commercially available 350×250 μm VCSEL and an 80 μm diameter multimode optical fiber. Test results of our demonstrator showed a correct optic coupling of the VCSEL into the fiber.
Keywords :
biomedical communication; biomedical optical imaging; cardiovascular system; catheters; data communication; laser applications in medicine; optical couplers; optical fibre communication; surface emitting lasers; F2R; Flex-to-Rigid technology platform; IVUS; VCSEL; cardiovascular interventional imaging guidewires; catheter; distal tip; flip-chipped Vertical-Cavity-Surface Emitting Laser; guidewire imaging devices; high speed data communication; high-speed optical data link; intravascular imaging devices; multimode optical fiber; optic coupling; optical data link assembly; proximal side; size 360 mum; small form-factor; through-wafer hole; wafer-scale demonstrator setup; Application specific integrated circuits; Assembly; Optical fiber communication; Optical fibers; Polyimides; Vertical cavity surface emitting lasers; CMUT; Flex-to-Rigid; data link; guidewire; micro assembly; minimally invasive instrument; optics;
Conference_Titel :
SENSORS, 2014 IEEE
Conference_Location :
Valencia
DOI :
10.1109/ICSENS.2014.6984972