• DocumentCode
    1894379
  • Title

    An electrical simulation model for the chalcogenide phase-change memory cell

  • Author

    Salamon, Daniel ; Cockburn, Bruce F.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Alberta Univ., Edmonton, Alta., Canada
  • fYear
    2003
  • fDate
    28-29 July 2003
  • Firstpage
    86
  • Lastpage
    91
  • Abstract
    Chalcogenide glass is being investigated by several companies as the basis for a scalable and embeddable nonvolatile phase-change memory technology. One phase is a high-resistance amorphous phase that is obtained by melting a small volume of glass using ohmic heating, and then quenching it. The second phase is a low-resistance crystalline phase that is obtained by heating the glass to just below the melting point to promote recrystallization. This paper describes two models for such a cell. The first is a very simple single-element, lumped model that exhibits correct phase transition behavior, but is unrealistic in its sensitivity to the heating current pulses. The second, multiple-element model is able to more realistically represent cell heating and cooling behavior, and appears to be the more suitable basis for an electrical simulation model.
  • Keywords
    chalcogenide glasses; circuit simulation; glass transition; lumped parameter networks; plasma ohmic heating; quenching (thermal); random-access storage; recrystallisation; cell cooling; cell heating; chalcogenide glass; electrical simulation model; high resistance amorphous phase; low resistance crystalline phase; melting point; memory cell; multiple element model; nonvolatile phase change memory technology; ohmic heating; phase transition; recrystallization; single element lumped model; Amorphous materials; Conductivity; Crystallization; Diodes; Glass; Heating; Nonvolatile memory; Phase change memory; Solids; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Memory Technology, Design and Testing, 2003. Records of the 2003 International Workshop on
  • ISSN
    1087-4852
  • Print_ISBN
    0-7695-2004-9
  • Type

    conf

  • DOI
    10.1109/MTDT.2003.1222366
  • Filename
    1222366