DocumentCode :
1894441
Title :
Design and operation of a cluster-tool-based rapid thermal processing module
Author :
Bayoumi, Am M. ; Silvestre, Conrad L. ; Keuhn, R.T. ; Hauser, John R.
Author_Institution :
NSF Eng. Res. Center for Adv. Electron. Mater. Process, North Carolina State Univ., Raleigh, NC, USA
fYear :
1993
fDate :
18-19 May 1993
Firstpage :
203
Lastpage :
207
Abstract :
A cluster tool rapid thermal processing module for single wafer processing is described. The various design and actual implementation issues are discussed, together with the operational characteristics. The module is then evaluated as a low thermal budget tool for MOS gate stack formation. Film quality is electrically assessed
Keywords :
integrated circuit manufacture; modules; plasma CVD; rapid thermal processing; surface treatment; MOS capacitors; MOS gate stack formation; cluster tool rapid thermal processing module; film quality; low thermal budget tool; operational characteristics; plasma cleaning; remote plasma enhanced chemical vapour deposition; single wafer processing; thermal processing module design; Cleaning; Computerized monitoring; Hydrogen; Lamps; Nitrogen; Plasma chemistry; Plasma materials processing; Pressure control; Rapid thermal processing; Windows;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
University/Government/Industry Microelectronics Symposium, 1993., Proceedings of the Tenth Biennial
Conference_Location :
Research Triangle Park, NC
ISSN :
0749-6877
Print_ISBN :
0-7803-0990-1
Type :
conf
DOI :
10.1109/UGIM.1993.297053
Filename :
297053
Link To Document :
بازگشت