DocumentCode
1894471
Title
Proceedings of the 6th International conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and MicroSystems
fYear
2006
fDate
18-20 April 2006
Abstract
Presents the title page for the Proceedings of the 6th International conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and MicroSystems.
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Conference_Location
Berlin, Germany
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502751
Filename
1502751
Link To Document