Title :
Prognostics-based health management for telecom equipment under free air cooling
Author :
Dai, Jun ; Das, Diganta ; Pecht, Michael
Author_Institution :
Center for Adv. Life Cycle Eng. (CALCE), Univ. of Maryland, College Park, MD, USA
Abstract :
The telecommunications industry is increasingly conscious of energy consumption and the environmental footprint of its data centers. At present, more than half of energy consumption of data centers is for the power and cooling infrastructure. One energy-efficient approach, free air cooling, uses ambient air, rather than air conditioning, to cool the equipment. Free air cooling is being adopted in existing data centers where the equipment has not been designed or qualified for free air cooling regime. Traditionally, product qualification is based on industry standards that assume pre-defined environmental conditions. However, the free air cooling condition may go beyond the pre-defined conditions, furthermore, it is not practical to interrupt data center services to re-qualify installed equipment. This paper identifies the challenges posed by introducing free air cooling to the installed equipment and presents a new prognostics-based approach for evaluating and mitigating the risks.
Keywords :
computer centres; condition monitoring; cooling; energy conservation; energy consumption; environmental factors; standards; telecommunication equipment; telecommunication industry; ambient air; cooling infrastructure; data center; energy consumption; energy efficiency; environmental condition; environmental footprint; free air cooling; industry standard; power infrastructure; product qualification; prognostics-based health management; telecom equipment; telecommunications industry; Cooling; Humidity; Monitoring; Prognostics and health management; Reliability; Telecommunications; Temperature sensors; data center; free air cooling; prognostics health management (PHM); reliability; telecom equipment;
Conference_Titel :
EUROCON - International Conference on Computer as a Tool (EUROCON), 2011 IEEE
Conference_Location :
Lisbon
Print_ISBN :
978-1-4244-7486-8
DOI :
10.1109/EUROCON.2011.5929411