DocumentCode :
1894729
Title :
1200 V high-side lateral MOSFET in junction-isolated power IC technology using two field-reduction layers
Author :
Ajit, J.S. ; Kinzer, Dan ; Ranjan, Niraj
Author_Institution :
International Rectifier, El Segundo, CA, USA
fYear :
1993
fDate :
18-20 May 1993
Firstpage :
230
Lastpage :
235
Abstract :
A lateral n-channel MOSFET structure in junction-isolated power IC technology using a P-type field-reduction region over an N-type field-reduction region for high-side and low-side switching applications is described. The concept of using two field-reduction layers has been verified by two-dimensional device simulations and by fabricating devices with breakdown voltage in excess of 1200 V
Keywords :
MOS integrated circuits; insulated gate field effect transistors; integrated circuit technology; power integrated circuits; 1200 V; breakdown voltage; field-reduction layers; high-side lateral MOSFET; high-side switching applications; junction-isolated power IC technology; low-side switching applications; two-dimensional device simulations; Body regions; CMOS technology; Circuit simulation; Dielectric substrates; MOSFET circuits; Power MOSFET; Power integrated circuits; Power semiconductor switches; Rectifiers; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 1993. ISPSD '93., Proceedings of the 5th International Symposium on
Conference_Location :
Monterey, CA
ISSN :
1063-6854
Print_ISBN :
0-7803-1313-5
Type :
conf
DOI :
10.1109/ISPSD.1993.297075
Filename :
297075
Link To Document :
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