DocumentCode
1894798
Title
Chapter 3, Designing for interface reliability
fYear
2005
fDate
18-20 April 2005
Firstpage
24
Lastpage
24
Keywords
Bonding processes; Electronic packaging thermal management; Finite element methods; Thermomechanical processes; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502765
Filename
1502765
Link To Document