Title :
Chapter 5, Modeling and characterization of solder joints
Keywords :
Aging; Creep; Environmentally friendly manufacturing techniques; Lead; Life testing; Soldering; Thermomechanical processes;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502776
