Title :
Detail Service: the necessary path for re-engineering the Chinese logistics enterprises´ competitive advantage in the low margin age
Author :
Weihua, Liu ; Jianhua, Ji ; Lu, Li
Author_Institution :
Antai Manage. Sch., Shanghai Jiao Tong Univ.
Abstract :
The low margin age is coming to the logistics service industry in China. How to re-engineer enterprise\´s competitive advantage in this low margin age becomes a most concerned topic for the logistics service providers in China. In this paper, we point out that the detail service is one of the new competitive advantages for the Chinese logistics service providers. The concept of "detail service" and its importance are expounded. We provide a four phases mechanism for re-engineering the logistics service providers\´ competitive advantage based on the detail service. For the further research on the relationship between the logistics detail service and the competitive advantage, a survey is realized. The result shows that detail service is accepted by most people working in the logistics industry. This paper also discusses how to execute the detail service from the four important aspects (the operational resources, the customers, the external environment and the human resources). The framework of detail service innovation is also provided. Finally, the conclusion is summarized and some further research directions are suggested
Keywords :
business process re-engineering; globalisation; logistics; service industries; Chinese logistics enterprises; Chinese logistics service providers; enterprise´s competitive advantage reengineering; human resources; logistics detail service; logistics service industry; margin age; operational resources; Accelerated aging; Aerospace industry; Costs; Globalization; Humans; Industrial relations; Logistics; Pulp manufacturing; Technological innovation; Detail Service; Logistics providers; Low margin age; Re-engineering of competitive advantages;
Conference_Titel :
Service Operations and Logistics, and Informatics, 2006. SOLI '06. IEEE International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0317-0
Electronic_ISBN :
1-4244-0318-9
DOI :
10.1109/SOLI.2006.328979