Title :
Creep of thermally aged SnAgCu-solder joints
Author :
Wiese, S. ; Roellig, M. ; Wolter, K.-J.
Author_Institution :
Lab. of Electron. Packaging, Dresden Univ. of Technol., Germany
Abstract :
The scope of the paper is to present creep data that was obtained from different specimens. It will be shown that the creep behaviour of SnAgCu-solder differs by specimen size and its manufacturing conditions. The paper focuses on the change of creep behaviour as a consequence of thermal aging of the solder. It compares the creep behaviour in the as-cast condition of the alloy with that after thermal storage for 24 h, 168 h and 1176 h at a temperature of 125°C. In addition the paper will point out the effect of different pad metallizations onto creep properties. The paper provides constitutive models for SnAg- and SnAgCu-solders in dependence on the type of pad metallization and aging condition.
Keywords :
ageing; creep; creep testing; reliability; solders; tin alloys; 1176 h; 125 C; 168 h; 24 h; SnAg; SnAgCu; as-cast condition; creep; manufacturing conditions; pad metallizations; solder joints; specimen size; thermal ageing; thermal storage; Aging; Creep; Electronic packaging thermal management; Electronics packaging; Metallization; Physics; Power system modeling; Soldering; Stress; Testing;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502778
