Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts

Author

Roellig, M. ; Dudek, Rainer ; Wiese, Steffen ; Wunderle, Berhard ; Wolter, Klaus-Jurgen ; Michel, Bernd

Author_Institution

IAVT, Dresden Univ. of Technol., Germany

fYear

2005

fDate

18-20 April 2005

Firstpage

86

Lastpage

90

Abstract

Many investigations in lead-free solder-bumps on real components have been done with more or less successful lifetime prediction. Thermo-mechanical loads during temperature cycle test e.g. -40° to +125°C the solder materials weaken thru time independent and time dependent plastically deformation. Solder bumps underneath real packages usually with chip on interposer are not only stressed by shear forces but also by tensile force in z-direction. The collected data may match the studied component very well, but is it possible to transfer it to other electronic packages?.

Keywords

bending; fatigue; finite element analysis; integrated circuit packaging; life testing; shear strength; solders; tensile strength; thermomechanical treatment; -40 to 125 C; electronic packages; experimental lifetime prediction; lead-free solder bumps; miniaturized lead-free solder contacts; shear forces; solder materials; temperature cycle test; tensile force; thermomechanical loads; time dependent plastically deformation; Assembly; Ceramics; Electronic packaging thermal management; Electronics packaging; Environmentally friendly manufacturing techniques; Integrated circuit interconnections; Lead; Life testing; Thermal stresses; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on

Print_ISBN

0-7803-9062-8

Type

conf

DOI

10.1109/ESIME.2005.1502779

Filename

1502779