DocumentCode
1895191
Title
Chapter 6, Modeling of material behavior
fYear
2005
fDate
18-20 April 2005
Firstpage
99
Lastpage
99
Keywords
Finite element methods; Flip chip; Mechanical factors; Moisture; Packaging; Semiconductor device measurement; Semiconductor films; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502781
Filename
1502781
Link To Document