DocumentCode
1895211
Title
Optimization of 4H-SiC power Schottky Barrier Diodes
Author
Shenai, Krishna
Author_Institution
Energy Syst. Div., Argonne Nat. Lab., Argonne, IL, USA
fYear
2013
fDate
21-23 May 2013
Firstpage
1
Lastpage
3
Abstract
Silicon Carbide (SiC) is among the most promising semiconductor for high-voltage and high-temperature power electronics switching applications. A careful analysis of the current state-of-the-art commercial 4H-SiC power Schottky Barrier Diodes (SBDs) shows that these devices are operated well below their true avalanche breakdown potential. It is found that the breakdown voltage ratings of these devices are smaller nearly by a factor of 2 due to increased leakage current caused by drift-region punch-through. A simple analysis is presented to determine the de-rating factor of SiC power SBDs using the information provided in the manufacturer´s data sheets. It is recommended that further improvement in material growth and manufacturing technologies offer significant promise in developing robust, low-cost, and high-performance SiC power switching devices.
Keywords
II-VI semiconductors; Schottky barriers; Schottky diodes; avalanche breakdown; leakage currents; silicon compounds; SiC; avalanche breakdown potential; breakdown voltage ratings; de-rating factor; drift-region punch-through; high-temperature power electronics switching applications; leakage current; manufacturing technologies; material growth; power Schottky barrier diodes; silicon carbide; Educational institutions; Performance evaluation; Resistance; Schottky barriers; Schottky diodes; Silicon carbide; Schottky barrier diode; Silicon Carbide (SiC); avalanche breakdown; cost; manufacturing; optimization; punch-through; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Energytech, 2013 IEEE
Conference_Location
Cleveland, OH
Type
conf
DOI
10.1109/EnergyTech.2013.6645337
Filename
6645337
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