Automatic testing of metalized ceramic-polyimide (MCP) substrates

Author

DeFoster, Steven ; Mancini, Martin ; Zalesinski, Jerzy

Author_Institution

IBM Corp., Endicott, NY, USA

fYear

1990

fDate

20-23 May 1990

Firstpage

548

Abstract

The automatic testing and handling of MCP substrates are discussed. The product and the manufacturing processes are described, and he challenges of testing the product and the defect mechanisms are discussed. The specific electrical tests done on the product are examined. Automatic product handling is discussed along with the technology involved with contacting the product. The test electronics and computer control are also described. every substrate is electrically tested twice. It is tested once after all of the photolithographic and wet processes but before pinning and tinning (midline test), and once before it is put on stock (end of line test)

Keywords

automatic testing; ceramics; electronic equipment manufacture; packaging; production testing; MCP substrates; automatic testing; computer control; defect mechanisms; electrical tests; end of line test; handling; manufacturing processes; metalized ceramic-polyimide; midline test; wet processes; Automatic testing; Ceramics; Circuit testing; Contacts; Dielectric thin films; Electronic equipment testing; Manufacturing processes; Polyimides; Resists; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1990. ., 40th

Conference_Location

Las Vegas, NV

Type

conf

DOI

10.1109/ECTC.1990.122241

Filename

122241