Title :
Modelling of fluid flow and heat transfer in a copper base heat sink application
Author_Institution :
R & D Div., Outokumpu Copper, Vasteras, Sweden
Abstract :
With the trend towards increasing speed of processors in smaller size of computers, there has been considerable interest in heat sink technologies with higher level of performance and further miniaturization. A three-dimensional finite-volume model has been developed and applied to investigate flow and conjugate heat transfer in the copper-based heat sink. The model was produced with commercial program FLUENT, which allows this nonlinear, highly turbulent problem to be simulated using the k-e turbulence model. The theoretical model developed is validated by comparing the predictions of the model with available experimental data. The thermal performance and temperature distribution for the heat sink were analysed and a procedure for optimizing the geometrical design parameters based on less space occupation and more efficient heat transfer coefficient is presented as the trend. Several design examples with different types of cooling methods and manufacturing processes have been analysed. The reliability and effectiveness in heat spreading of those has been compared. It has been shown that the copper-based rectangular heat sink with straight fins (case No.1) has an optimum design configuration.
Keywords :
copper; finite volume methods; heat sinks; heat transfer; integrated circuit packaging; microprocessor chips; reliability; temperature distribution; thermal management (packaging); 3D finite-volume model; FLUENT; conjugate heat transfer; cooling methods; copper-based heat sink; fluid flow; geometrical design parameters; heat sink technology; heat transfer coefficient; k-e turbulence model; miniaturization; optimum design; processor speed; reliability; temperature distribution; thermal performance; Application software; Copper; Fluid flow; Heat sinks; Heat transfer; High performance computing; Performance analysis; Predictive models; Space heating; Temperature distribution;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502790