DocumentCode
1895454
Title
Chapter 8, Designing for reliability and optimization
fYear
2005
fDate
18-20 April 2005
Firstpage
155
Lastpage
155
Keywords
Anisotropic conductive films; Design optimization; Electronic packaging thermal management; Moisture; Probes; Response surface methodology;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502791
Filename
1502791
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