Title :
Passive-silicon-carrier design and characteristics
Author_Institution :
IBM Lab., Boeblingen, Germany
Abstract :
A silicon-on-silicon package for nine VLSI chips is presented. The carrier is especially designed to support the high-frequency current surges of complementary logic like CMOS or BiCMOS. It contains integrated decoupling capacitors and uses three layers of metal. The chips are mounted by controlled-collapse chip connection. A /370 processor containing nine CMOS chips has been assembled. Functionality and manufacturability have successfully been demonstrated
Keywords :
CMOS integrated circuits; VLSI; packaging; /370 processor; BiCMOS; CMOS; VLSI chips; complementary logic; controlled-collapse chip connection; functionality; high-frequency current surges; integrated decoupling capacitors; manufacturability; passive-silicon-carrier design; Assembly; BiCMOS integrated circuits; CMOS logic circuits; CMOS process; Capacitors; Logic design; Manufacturing; Packaging; Surges; Very large scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ECTC.1990.122243
