DocumentCode
1895918
Title
Intra-die process parameter variation and leakage analysis of cache at the microarchitectural level
Author
Agarwal, Manjari ; Elakkumanan, Praveen ; Sridhar, Ramalingam
Author_Institution
Dept. of Computer Science and Engineering, University at Buffalo (SUNY), New York 14260, USA
fYear
2007
fDate
26-29 Sept. 2007
Firstpage
79
Lastpage
82
Abstract
As technology scales down to the nanometer domain, leakage currents begin to contribute significantly to the total power consumption of the chip. In addition, it becomes increasingly difficuilt to control the transistor device parameters. This causes increased heat dissipation in the chip and the degradation in the frequency of operation, thus compromising the reliability of the chip. Hence, it becomes necessary to model the leakage currents and variabilities observed in minimum geometry transistors early in the design flow, to be able to design a low-power, dense and robust cache architecture. In this paper, we present CacheSim, a cache memory simulator that includes compact models for both intra-die process parameter variations and leakage currents in the conventional cache architecture, to give an accurate estimate of memory power at the system level, and the cache access time.
Keywords
Cache memory; Degradation; Energy consumption; Frequency; Geometry; Leakage current; Microarchitecture; Robustness; Solid modeling; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
SOC Conference, 2007 IEEE International
Conference_Location
Hsin Chu, Taiwan
Print_ISBN
978-1-4244-1592-2
Electronic_ISBN
978-1-4244-1593-9
Type
conf
DOI
10.1109/SOCC.2007.4545431
Filename
4545431
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