Title :
Reliability analysis of lead-free BGA assemblies linking FE simulations and experimental results
Author :
Guédon-Gracia, Alexandrine ; Roux, Pierre ; Woirgard, Eric ; Zardini, Christian
Author_Institution :
ENSEIRB, Univ. Bordeaux 1, Talence, France
Abstract :
Lead-free BGA assemblies are submitted to accelerated ageing test in order to determine the cycle number lead to the failure. The thermo-mechanical simulations are carried out on the assembly model in order to compute the strain energy density dissipated in the solder joints during the thermal cycles. Then the correlation between the experimentations and the simulations allows to predict the cycle number lead to the failure for another test.
Keywords :
ageing; assembling; ball grid arrays; finite element analysis; materials testing; reliability; thermomechanical treatment; FE simulation; accelerated ageing test; assembly model; cycle number; lead-free BGA assembly; reliability analysis; solder joint; strain energy density; thermal cycle; thermomechanical simulation; Accelerated aging; Analytical models; Assembly; Computational modeling; Environmentally friendly manufacturing techniques; Iron; Joining processes; Lead; Life estimation; Testing;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502811
