Title :
Multichip thin-film technology for low temperature packaging [CCD image sensors]
Author :
Chen, Cherh-Lin ; Johnson, R. Wayne ; Jaeger, Richard C. ; Cornelius, Michael B. ; Foste, Winfred A.
Author_Institution :
Dept. of Electr. Eng., Auburn Univ., AL, USA
Abstract :
An advanced astrometric sensor array (AASA) of charge coupled device (CCD) chips has been constructed using hybrid multichip packaging technology for operation at -140°C. Precise alignment of the CCD chips, long-term thermal cycling between 25°C and -140°C, and electrical signal coupling were challenges in the construction of the AASA. A series of AASA prototypes was fabricated with various epoxies, circuitry layouts, and substrate thicknesses in order to obtain materials, fabrication processes, and a structure suitable for construction of the AASA. A silicon template was fabricated by anisotropic etching and used to align the CCD sensors. The AASA samples were evaluated by thermal cycling (27°C to -138°C) and die shear tests. Computer modeling was used for thermal stress analysis of the mechanical behavior of the AASA as a function of temperature. The coupled noise between long parallel lines (1.5 cm) on the AASA was investigated by circuit simulation and experimental measurements. The experimental and modeling results are presented
Keywords :
CCD image sensors; astrometry; astronomical telescopes; life testing; packaging; -140 degC; CCD sensors; advanced astrometric sensor array; anisotropic etching; charge coupled device; circuitry layouts; die shear tests; electrical signal coupling; hybrid multichip packaging technology; long parallel lines; long-term thermal cycling; low temperature packaging; thermal stress analysis; Charge coupled devices; Charge-coupled image sensors; Coupling circuits; Packaging; Prototypes; Sensor arrays; Substrates; Temperature sensors; Thermal stresses; Transistors;
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ECTC.1990.122245