New experimental approach for failure prediction in electronics: topography and deformation measurement complemented with acoustic microscopy

Topography and deformation measurements (T.D.M.) under thermomechanical solicitation is a new approach for localising and quantifying deformation of electronic assemblies. Cooling and heating capabilities, with different temperature rate and maximum, following JEDEC thermal profiles for example, have been applied on different components before and after assembly using real time topography and deformation measurements. The interest in being able to perform z and (x, y) deformation measurements for traction/compression and shear stress evaluation will be shown. Using acoustic microscopy before and after thermal stress gives the possibility to detect both the conditions in which elastic limits may have exceeded at interfaces, which interface is concerned and the speed at which delamination occurs. Complementarities of this new technique with acoustic microscopy and simulation will be shown for failure prediction applications.