DocumentCode
1896391
Title
Lateral compensation structures can break the silicon limit
Author
Tolksdorf, C. ; SchuIze, J. ; Eisele, I. ; Deboy, G.
Author_Institution
Inst. fur Phys., Univ. der Bundeswehr Munchen, Neubiberg, Germany
Volume
1
fYear
2004
fDate
20-25 June 2004
Firstpage
585
Abstract
Power MOSFET design is based on solving the trade-off between breakdown voltage and on-resistance of the device. Standard vertical DMOS (Double Diffused MOS) devices show the following relation RonA∝VBD2.5 wherein the drift region determines the on-resistance. This drift region resistance can be greatly improved by superjunction devices based on the compensation principle. Compensation structures also promise for lateral power MOSFETs an immense enhancement in the relation between on-resistance and breakdown voltage. Furthermore the advantage of lateral power MOSFETs consists in the easy integration in smart-power devices. We could prove in our work that lateral compensation structures decrease the on-resistance of the drift region while preserving the breakdown voltage. Therefore it is possible to break the silicon limit.
Keywords
MOS integrated circuits; compensation; electric resistance; silicon compounds; DMOS; breakdown voltage; device on-resistance; double diffused MOS; drift region resistance; lateral compensation structures; power MOSFET; silicon; smart-power devices; superjunction devices; Consumer electronics; Dielectric devices; Doping; Electronics cooling; Electronics industry; MOSFET circuits; Monolithic integrated circuits; Power MOSFET; Silicon; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Specialists Conference, 2004. PESC 04. 2004 IEEE 35th Annual
ISSN
0275-9306
Print_ISBN
0-7803-8399-0
Type
conf
DOI
10.1109/PESC.2004.1355813
Filename
1355813
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