• DocumentCode
    1896391
  • Title

    Lateral compensation structures can break the silicon limit

  • Author

    Tolksdorf, C. ; SchuIze, J. ; Eisele, I. ; Deboy, G.

  • Author_Institution
    Inst. fur Phys., Univ. der Bundeswehr Munchen, Neubiberg, Germany
  • Volume
    1
  • fYear
    2004
  • fDate
    20-25 June 2004
  • Firstpage
    585
  • Abstract
    Power MOSFET design is based on solving the trade-off between breakdown voltage and on-resistance of the device. Standard vertical DMOS (Double Diffused MOS) devices show the following relation RonA∝VBD2.5 wherein the drift region determines the on-resistance. This drift region resistance can be greatly improved by superjunction devices based on the compensation principle. Compensation structures also promise for lateral power MOSFETs an immense enhancement in the relation between on-resistance and breakdown voltage. Furthermore the advantage of lateral power MOSFETs consists in the easy integration in smart-power devices. We could prove in our work that lateral compensation structures decrease the on-resistance of the drift region while preserving the breakdown voltage. Therefore it is possible to break the silicon limit.
  • Keywords
    MOS integrated circuits; compensation; electric resistance; silicon compounds; DMOS; breakdown voltage; device on-resistance; double diffused MOS; drift region resistance; lateral compensation structures; power MOSFET; silicon; smart-power devices; superjunction devices; Consumer electronics; Dielectric devices; Doping; Electronics cooling; Electronics industry; MOSFET circuits; Monolithic integrated circuits; Power MOSFET; Silicon; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Specialists Conference, 2004. PESC 04. 2004 IEEE 35th Annual
  • ISSN
    0275-9306
  • Print_ISBN
    0-7803-8399-0
  • Type

    conf

  • DOI
    10.1109/PESC.2004.1355813
  • Filename
    1355813