DocumentCode
1896500
Title
Chapter 13, Thermal modeling and characterization in microelectronics
fYear
2005
fDate
18-20 April 2005
Firstpage
371
Lastpage
371
Keywords
Ceramics; Design optimization; MOSFETs; Microelectronics; Power measurement; Semiconductor devices; Sensor phenomena and characterization; Software measurement; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502830
Filename
1502830
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