Title :
Comparison of lifetime predictions with 3D finite element model of power electronics devices
Author :
Moreau, S. ; Leroy, R. ; Lequeu, T. ; Jérisian, R.
Author_Institution :
Univ. F. Rabelais de Tours, Tours cedex 2, France
Abstract :
Reliability tests and simulated results on medium power components are discussed in this paper. This study is based on statistical data coming from thermal cycling tests (TCT, air-air test) and thermal shock tests (TST, liquid-liquid test), which are correlated with information coming from failure analysis and compared to results issued from 3D finite element (FE) analysis.
Keywords :
failure analysis; finite element analysis; life testing; power semiconductor devices; semiconductor device reliability; thermal stress cracking; 3D finite element model; failure analysis; lifetime predictions; power electronics devices; reliability test; thermal cycling tests; thermal shock tests; Electric resistance; Electric shock; Electronic equipment testing; Electronic packaging thermal management; Finite element methods; Life testing; Power electronics; Predictive models; Temperature; Thermal resistance;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502844
