DocumentCode
1896816
Title
Measurement of acceleration factor for lead-free solder (SnAg3.8Cu0.7) in thermal cycling test of BGA components and calibration of lead-free solder joint model for life prediction by finite element analyses
Author
Andersson, Karl ; Salmela, O. ; Perttula, A. ; Särkkä, J. ; Tammenmaa, M.
Author_Institution
Nokia Res. Center, Nokia Group, Helsinki, Finland
fYear
2005
fDate
18-20 April 2005
Firstpage
448
Lastpage
453
Abstract
Lead-free solder is taken into use in the electronics industry and there is a lack of data which shows how much thermal cycling tests accelerate the failure mechanisms compared to the real use conditions for the lead-free alloy. In this paper, a methodology on how to estimate the acceleration factor (AF) is described. The AF-experiments give an indication that the AF between the tests carried out at -40 - +125 °C and 30 - 80 °C is approximately 10 to 13. The test results have also been used to create a solder joint fatigue model for lead-free soldered BGA components. The model can be used to predict solder joint life by using finite element analyses in other environments.
Keywords
ball grid arrays; copper alloys; failure analysis; fatigue testing; finite element analysis; life testing; silver alloys; solders; thermal stress cracking; tin alloys; -40 to 125 C; BGA components; SnAg3.8Cu0.7; acceleration factor measurement; ball grid arrays; fatigue model; finite element analysis; lead free solder; life prediction; solder joint; thermal cycling test; Acceleration; Accelerometers; Electronic equipment testing; Electronics industry; Environmentally friendly manufacturing techniques; Failure analysis; Fatigue; Lead; Life estimation; Soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502847
Filename
1502847
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