DocumentCode
1897056
Title
Chapter 15, Prediction on dynamic behavior
fYear
2005
fDate
18-20 April 2005
Firstpage
502
Lastpage
502
Keywords
Computational modeling; Mechanical factors; Soldering; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502856
Filename
1502856
Link To Document