DocumentCode
189708
Title
Study of a piezoresistive cantilever used as a temperature sensing structure in low temperature environments
Author
Jian-Qiu Huang ; Qing-Hai Liu ; Chun-Hua Cai
Author_Institution
Key Lab. of MEMS of the Minist. of Educ., Southeast Univ., Nanjing, China
fYear
2014
fDate
2-5 Nov. 2014
Firstpage
823
Lastpage
826
Abstract
This paper presents the temperature characteristics of piezoresistive cantilevers in low temperature environments. A thick aluminum film was used as a thermal sensitive material because the thermal expansion coefficient of the aluminum is about 10 times and 50 times larger than the silicon and silicon dioxide respectively. The structure was tested at temperatures ranged from -60 to 40°C and temperature cycling tests were carried out. Each sensitive structure exhibited repeatable performance except the first cycle which indicated an unrecoverable deformation in the first cycle. At lower temperature, the hysteresis became worse. It implied not only the temperature but also the temperature loading process contributed to the sensitive characteristics of the piezoresistive cantilever.
Keywords
cantilevers; piezoresistive devices; temperature sensors; thermal expansion measurement; thick film sensors; piezoresistive cantilever; temperature -60 degC to 40 degC; temperature cycling testing; temperature loading process; temperature sensing structure; thermal expansion coefficient; thermal sensitive material; thick aluminum film; Piezoresistance; Silicon; Temperature distribution; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
SENSORS, 2014 IEEE
Conference_Location
Valencia
Type
conf
DOI
10.1109/ICSENS.2014.6985126
Filename
6985126
Link To Document