Title : 
Hybrid experimental and computational approach for rate dependent mechanical properties using indentation techniques
         
        
            Author : 
Varghese, J. ; Radig, G. ; Herkommer, D. ; Dasgupta, A.
         
        
            Author_Institution : 
CALCE Electron. Packaging & Syst. Center, Maryland Univ., College Park, MD, USA
         
        
        
        
        
        
            Abstract : 
This paper introduces a hybrid test methodology, based on dynamic indentation, to determine the high strain rate properties of materials. A conical indentation test setup, with real time measurement of load and indent depth, is developed for this purpose. Tests are conducted to obtain the load displacement (P-h) curves at different loading rates. Non-linear dynamic finite element analysis (FEA), using an iterative inverse solution technique, is used to convert the experimental data into stress-strain curves at different strain rates. The inverse solution technique involves varying the stress-strain curves until the load-displacement curves obtained from simulation matches the experimentally measured data. Results indicate that the uni-axial dynamic characterization tests under-predict the material properties of the specimen, when compared to the indentation tests. This is important for the characterization of materials that experience localized plasticity; eg. Structures subjected to drop and impact.
         
        
            Keywords : 
electronics packaging; finite element analysis; indentation; materials testing; mechanical variables measurement; polymers; reliability; stress-strain relations; dynamic indentation; hybrid test methodology; iterative inverse solution; load-displacement curves; nonlinear dynamic finite element analysis; rate dependent mechanical property; real time measurement; stress-strain curves; Capacitive sensors; Conducting materials; Creep; Educational institutions; Electronics packaging; Grain size; Materials testing; Mechanical factors; Nonlinear dynamical systems; Polymers;
         
        
        
        
            Conference_Titel : 
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
         
        
            Print_ISBN : 
0-7803-9062-8
         
        
        
            DOI : 
10.1109/ESIME.2005.1502858