DocumentCode
1897262
Title
Chapter 17, Designing for packaging reliability
fYear
2005
fDate
18-20 April 2005
Firstpage
538
Lastpage
538
Keywords
Chip scale packaging; Environmentally friendly manufacturing techniques; Fatigue; Geometry; Lead; Life testing; Material properties; Predictive models; Solid modeling; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502863
Filename
1502863
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