Title :
Thermal-mechanical coupling analysis for coupled power and thermal cycling reliability of chip-scale packages
Author :
Lai, Yi-Shao ; Wang, Tong Hong ; Lee, Chang-Chi
Author_Institution :
Stress-Reliability Lab., Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan
Abstract :
The sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermo-mechanical deformations, is carried out in this paper to investigate thermal characteristics along with fatigue reliability of board-level thin-profile fine-pitch ball grid array chip-scale packages under coupled power and thermal cycling test conditions. Pure thermal cycling and pure power cycling test conditions are also examined and compared.
Keywords :
chip scale packaging; deformation; fine-pitch technology; finite element analysis; reliability; thermal stress cracking; ball grid array; chip scale packages; coupled power reliability; fatigue reliability; thermal characteristics; thermal cycling reliability; thermalmechanical coupling analysis; thermomechanical deformations; transient temperature field; Chip scale packaging; Circuit testing; Electronic packaging thermal management; Fatigue; Performance evaluation; Temperature; Thermal engineering; Thermal stresses; Thermomechanical processes; Transient analysis;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502864
