Thermal-mechanical coupling analysis for coupled power and thermal cycling reliability of chip-scale packages

Author

Lai, Yi-Shao ; Wang, Tong Hong ; Lee, Chang-Chi

Author_Institution

Stress-Reliability Lab., Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan

fYear

2005

fDate

18-20 April 2005

Firstpage

539

Lastpage

544

Abstract

The sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermo-mechanical deformations, is carried out in this paper to investigate thermal characteristics along with fatigue reliability of board-level thin-profile fine-pitch ball grid array chip-scale packages under coupled power and thermal cycling test conditions. Pure thermal cycling and pure power cycling test conditions are also examined and compared.

Keywords

chip scale packaging; deformation; fine-pitch technology; finite element analysis; reliability; thermal stress cracking; ball grid array; chip scale packages; coupled power reliability; fatigue reliability; thermal characteristics; thermal cycling reliability; thermalmechanical coupling analysis; thermomechanical deformations; transient temperature field; Chip scale packaging; Circuit testing; Electronic packaging thermal management; Fatigue; Performance evaluation; Temperature; Thermal engineering; Thermal stresses; Thermomechanical processes; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on

Print_ISBN

0-7803-9062-8

Type

conf

DOI

10.1109/ESIME.2005.1502864

Filename

1502864