DocumentCode
1897617
Title
Chapter 20, Multiscale modeling and experiments
fYear
2005
fDate
18-20 April 2005
Firstpage
634
Lastpage
634
Keywords
Bonding; Creep; Crystal microstructure; Environmentally friendly manufacturing techniques; Finite element methods; Lead; Packaging; Silicon; Stress; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502879
Filename
1502879
Link To Document