DocumentCode :
1897765
Title :
Effect of implantation energy on surface pitting of SIMOX
Author :
Namavar, F. ; Cortesi, E. ; Manke, J.M. ; Kalkhoran, N.M. ; Buchanan, B.L. ; Pinizzotto, R.F. ; Yang, H.
Author_Institution :
Spire Corp., Bedford, MA, USA
fYear :
1991
fDate :
1-3 Oct 1991
Firstpage :
108
Lastpage :
109
Abstract :
A systematic study to determine the effect of dose and dose rate on implanting oxygen at 80 and 160 keV is reported. Samples were produced by implanting oxygen into p-type Si(100) wafers at dose rates of 5-60 μA/cm2 and doses from 3×1017 to 1.6×1018 O+/cm2 using an Eaton NV10-160 implanter. Samples were studied using cross-sectional transmission electron microscopy, scanning electron microscopy, and Rutherford backscattering spectroscopy. The results obtained suggest that dose, dose rate, and energy thresholds for pit formation in the Si top layer of SIMOX (separation by implanted oxygen) samples exist. For example, for doses of both 3×1017 and 4×1017 O+/cm2 the dose rate threshold is between 50 and 60 μA/cm2. It is also shown that the threshold for pit formation can be increased by implanting through an oxide capping layer
Keywords :
Rutherford backscattering; ion beam effects; ion implantation; ion-surface impact; oxygen; scanning electron microscope examination of materials; semiconductor-insulator boundaries; transmission electron microscope examination of materials; 160 keV; 80 keV; Eaton NV10-160 implanter; O implantation; O+ ions; RBS spectroscopy; Rutherford backscattering spectroscopy; SIMOX; Si; Si top layer; XTEM SEM; cross-sectional transmission electron microscopy; dose rates; doses; energy thresholds; implantation energy; oxide capping layer; pit formation; scanning electron microscopy; surface pitting; systematic study; Annealing; Energy measurement; Fabrication; Nitrogen; Oxygen; Scanning electron microscopy; Silicon; Temperature control; Temperature measurement; Transmission electron microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 1991. Proceedings, 1991., IEEE International
Conference_Location :
Vail Valley, CO
Print_ISBN :
0-7803-0184-6
Type :
conf
DOI :
10.1109/SOI.1991.162880
Filename :
162880
Link To Document :
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