Title :
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
Author :
Steenberge, Nele Van ; Vandevelde, Bart ; Schildermans, Inge ; Willems, Geert
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
The development of a simplified analytical model to describe the thermal history of a printed circuit board assembly (PCA) during convective reflow soldering is described in this paper. Verification of the assumptions was done by finite element modeling, as well as comparison with experimental measured temperature profiles.
Keywords :
finite element analysis; printed circuit manufacture; reflow soldering; thermal management (packaging); PCA; analytical model; convective reflow soldering; electronic assembly; finite element model; lead-free soldering; printed circuit board assembly; thermal behavior; Analytical models; Assembly; Environmentally friendly manufacturing techniques; Finite element methods; History; Lead; Printed circuits; Semiconductor device modeling; Soldering; Temperature measurement;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502887
