Title :
Evaluation of gas permeability for micro-scale thin polymer film with encapsulated MEMS damped oscillator
Author :
Gando, Ryunosuke ; Nakamura, Naofumi ; Hayashi, Yumi ; Ono, Daiki ; Masunishi, Kei ; Tomizawa, Yasushi ; Yamazaki, Hiroaki ; Ikehashi, Tamio ; Sugizaki, Yoshiaki ; Shibata, Hideki
Author_Institution :
Center for Semicond. R&D, Toshiba Corp., Kawasaki, Japan
Abstract :
We present a practical method to evaluate gas permeability for thin polymer films using an encapsulated micro-electro-mechanical-system (MEMS) oscillator. Previously, we have developed a hermetic thin-film dome structure for RF-MEMS tunable capacitor, using conventional back-end-of-the-line (BEOL) processes. The dome is made of multiple layers including a polymer film, whose gas permeability is an important factor with respect to productivity and reliability. So far, it had been difficult to evaluate the gas permeability for such small and thin polymer films with sub-millimeter diameter and micron-scale thickness. In this evaluation method, the pressure dependence of air-damping oscillation is used to measure the permeability. As a demonstration, we carried out a permeability measurement of a 0.5-mm-diameter dome sealed with a thin (1 μm) polymer film. The resulting permeability coefficient is found to be 1×10-16 mol/m/Pa/s, at room temperature.
Keywords :
damping; encapsulation; microfabrication; microsensors; permeability; polymer films; pressure measurement; radiofrequency oscillators; thin film capacitors; thin film sensors; RF-MEMS tunable capacitor; air damping oscillation; backend of the line process; encapsulated MEMS damped oscillator; gas permeability evaluation; hermetic thin film dome structure; microelectromechanical system; microscale thin polymer film; size 0.5 mm; size 1 mum; Damping; Micromechanical devices; Oscillators; Permeability; Polymer films; Q-factor; MEMS; Quality factotr; damping oscillation; gas permeability; polymer film;
Conference_Titel :
SENSORS, 2014 IEEE
Conference_Location :
Valencia
DOI :
10.1109/ICSENS.2014.6985164