DocumentCode
1897841
Title
Chapter 22, New developments in modeling and experiments - part II
fYear
2005
fDate
18-20 April 2005
Firstpage
687
Lastpage
687
Keywords
Intermetallic; Microelectronics; Soldering; Thermal management; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502889
Filename
1502889
Link To Document