• DocumentCode
    189918
  • Title

    Irradiation effects of the inline packaged RF MEMS power sensor

  • Author

    Zhiqiang Zhang ; Xiaoping Liao

  • Author_Institution
    Key Lab. of MEMS, Southeast Univ., Nanjing, China
  • fYear
    2014
  • fDate
    2-5 Nov. 2014
  • Firstpage
    1284
  • Lastpage
    1287
  • Abstract
    This paper studies the irradiation effects of the packaged GaAs monolithic microwave integrated circuits (MMIC)-based inline radio frequency microelectromechanical systems (RF MEMS) power sensor, in order to make it be used in wireless radiation environments. The effects of radiation signals 0.5-100 mW in power and 20-35 GHz in frequency on the linearity and sensitivity of the packaged inline RF MEMS power sensor are investigated. The experiments show that the radiation RF signals result in additional output thermovoltages in this sensor when the input signal is off, with the good linear relationships. The radiation frequency with the maximum output thermovoltages is recorded at 25.5 GHz.
  • Keywords
    III-V semiconductors; MIMIC; MMIC; electric sensing devices; gallium arsenide; integrated circuit design; integrated circuit packaging; microfabrication; microsensors; power measurement; radiation hardening (electronics); temperature sensors; voltage measurement; GaAs; MMIC; RF signal radiation; frequency 20 GHz to 35 GHz; inline packaged RF MEMS power sensor; inline radiofrequency microelectromechanical system; irradiation effect; monolithic microwave integrated circuit; output thermovoltage recording; power 0.5 mW to 100 mW; wireless radiation environment; Coplanar waveguides; Couplings; Gallium arsenide; Micromechanical devices; Power measurement; Radiation effects; Radio frequency; GaAs monolithic microwave integrated circuits (MMIC); irradiation effect; power sensor; radio frequency microelectromechanical systems (RF MEMS); thermovoltages;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2014 IEEE
  • Conference_Location
    Valencia
  • Type

    conf

  • DOI
    10.1109/ICSENS.2014.6985245
  • Filename
    6985245