DocumentCode
189995
Title
An inline insertion microwave MEMS power sensor based on GaAs MMIC technology with ultra reflection losses
Author
Zhiqiang Zhang ; Xiaoping Liao
Author_Institution
Key Lab. of MEMS, Southeast Univ., Nanjing, China
fYear
2014
fDate
2-5 Nov. 2014
Firstpage
1463
Lastpage
1466
Abstract
This paper proposes an inline insertion microwave microelectromechanical systems (MEMS) power sensor based on measuring the power dissipated by intrinsic ohmic losses of a coplanar waveguide (CPW) signal line by thermopiles. In order to achieve ultra reflection losses, cold junctions of the thermopiles are covered with the CPW ground lines for depressing electromagnetic coupling effects and serving as hot sink. To increase the sensitivity, the CPW ground lines are suspended above hot junctions of the thermopiles for reducing thermal losses and the CPW dimension near the thermopiles is designed to increase the temperature of the hot junctions. This sensor is completely compatible with the GaAs monolithic microwave integrated circuits (MMIC) technology. Experiments show that this optimized power sensor has resulted in reflection losses of less than -24.3 dB up to 26 GHz, with insertion losses of less than 0.37 dB. For the input power of 0.5-300 mW, the good linearity of the output response is obtained and average sensitivities are more than 6.26 and 8.21 mV/W at 2 and 20 GHz, respectively.
Keywords
III-V semiconductors; MMIC; coplanar waveguides; gallium arsenide; microsensors; microwave measurement; power measurement; thermopiles; CPW ground lines; GaAs; GaAs MMIC technology; coplanar waveguide signal line; inline insertion microwave MEMS power sensor; insertion losses; intrinsic ohmic losses; microelectromechanical systems; monolithic microwave integrated circuits; power 0.5 mW to 300 mW; thermopiles; ultrareflection losses; Coplanar waveguides; Micromechanical devices; Microwave circuits; Microwave integrated circuits; Microwave measurement; GaAs monolithic microwave integrated circuits (MMIC); inline; insertion; microelectromechanical systems (MEMS); microwave power measurement; reflection;
fLanguage
English
Publisher
ieee
Conference_Titel
SENSORS, 2014 IEEE
Conference_Location
Valencia
Type
conf
DOI
10.1109/ICSENS.2014.6985290
Filename
6985290
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