Title :
Non-invasive blood pressure remote monitoring instrument based microcontroller
Author :
Abu Zneid, Basem ; Al-zidi, Mohammed ; Al-kharazi, Tareq
Author_Institution :
Dept. of Biomed. Instrum. & Signal Process., Univ. Teknol. Malaysia, Skudai, Malaysia
Abstract :
The paper presents design and development of a Non-invasive wireless blood pressure data acquisition instrument for remote monitoring based Micro-controller and Bluetooth transmission kit. The real-time blood pressure biomedical signal is measured using an optical measurement circuit based Plethysmography technique (PPG) continuously for a long period of time. The detected measured signal amplified using an operational amplifier circuit and interfaced with the Micro-controller. Blood pressure readings with help of developed algorithm has been calculated and transmitted via Bluetooth kit to the stationary computer. Numerical reading values of systolic and diastolic blood pressure remotely recorded and displayed with help of LCD as well stationary computer. Furthermore, the obtained results were compared with existing devices data like a Sphygmomanometer to verify the accuracy of the developed Instrument.
Keywords :
Bluetooth; biomedical equipment; blood pressure measurement; blood vessels; data acquisition; medical image processing; medical information systems; microcontrollers; patient monitoring; photoplethysmography; Bluetooth transmission kit; LCD; blood pressure readings; diastolic blood pressure; noninvasive wireless blood pressure data acquisition instrument; numerical reading values; operational amplifier circuit; optical measurement circuit based plethysmography technique; real-time blood pressure biomedical signal; remote monitoring based microcontroller; sphygmomanometer; stationary computer; systolic blood pressure; Biomedical monitoring; Blood; Blood pressure; Bluetooth; Microcontrollers; Pressure measurement; Noninvassive measurement; continuous blood pressure; monitoring system; wireless;
Conference_Titel :
Region 10 Symposium, 2014 IEEE
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4799-2028-0
DOI :
10.1109/TENCONSpring.2014.6863036