Title :
Analytical capacitance model for high-speed interconnects with diagonal routing
Author :
Sim, Sang-Pil ; Arora, Narain D. ; Chao, Charlie ; Krishnan, Shoba ; Lee, Kwyro ; Yang, Cary Y.
Author_Institution :
Santa Clara Univ., CA, USA
Abstract :
We propose a novel quasi-3D capacitance model based on an "effective width" (Weff) concept. The model is derived from a new analytical 2D model combined with a 3D "wall-to-wall" approach. With Weff, complicated 3D structures are readily interpreted as a combination of consecutive 2D structures, leading to efficient capacitance extraction. The analytical 2D model is generated for easy application to recent technology, featuring multilayer dielectric and non-ideal vertical profile. Finally, our model is generalized to diagonal routing and confirmed by comparison with a field solver.
Keywords :
capacitance; high-speed integrated circuits; integrated circuit interconnections; integrated circuit modelling; network routing; 3D wall-to-wall approach; VLSI systems; analytical 2D model; analytical capacitance model; capacitance extraction; diagonal routing; effective width concept; high-speed interconnects; multilayer dielectric; nonideal vertical profile; quasi-3D capacitance model; Analytical models; Capacitance; Chaos; Clocks; Delay; Dielectrics; Routing; Solid modeling; Space technology; Wires;
Conference_Titel :
Interconnect Technology Conference, 2002. Proceedings of the IEEE 2002 International
Print_ISBN :
0-7803-7216-6
DOI :
10.1109/IITC.2002.1014919
