• DocumentCode
    1900779
  • Title

    Fast prediction for conducted EMI in flyback converters

  • Author

    Jianwei Liu ; Yi Wang ; Dan Jiang ; Qunsheng Cao

  • Author_Institution
    Coll. of Electron. & Inf. Eng., Nanjing Univ. of Aeronaut. & Astronaut., Nanjing, China
  • fYear
    2015
  • fDate
    2-5 Feb. 2015
  • Firstpage
    247
  • Lastpage
    249
  • Abstract
    The flyback switched mode power supply often fails in electromagnetic compatibility (EMC) because of the easily aroused conducted electromagnetic interference (EMI). However, the measurement of conducted EMI during initial compliance tests requires strict test environments and expensive facilities, this makes the prediction of EMI important. This paper presents a time domain simulation method to predict the conducted EMI of a flyback converter before prototyping. The CST PCB Studio is utilized to extract parasitic parameters of a printed circuit board (PCB) based on 2D field solver and perform total circuit simulation. Experimental results validate that the presented modeling method is efficient and fast to predict EMI.
  • Keywords
    AC-DC power convertors; conformance testing; electromagnetic compatibility; electromagnetic interference; printed circuits; switched mode power supplies; time-domain analysis; 2D field solver; AC-DC power conversion; CST PCB Studio; EMC; compliance tests; electromagnetic compatibility; electromagnetic interference; fast conducted EMI prediction; flyback converters; flyback switched mode power supply; parasitic parameter extraction; printed circuit board; time domain simulation method; total circuit simulation; Capacitance; Electromagnetic compatibility; Electromagnetic interference; Integrated circuit modeling; Noise; Predictive models; Switched-mode power supply; AC-DC power conversion; EMC; EMI; Electromagnetic conductive interference; Prediction methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computational Electromagnetics (ICCEM), 2015 IEEE International Conference on
  • Conference_Location
    Hong Kong
  • Type

    conf

  • DOI
    10.1109/COMPEM.2015.7052622
  • Filename
    7052622