Title :
Single wafer RapidCuring™ of porous low-k materials
Author :
Waldfried, Carlo ; Han, Qingyuan ; Escorcia, Orlando ; Margolis, Ari ; Albano, Ralph ; Berry, Ivan
Author_Institution :
Axcelis Technol. Inc., Rockville, MD, USA
Abstract :
Non-traditional curing solutions that are based on plasma or UV assisted processes have proven advantageous for the curing of low-k materials. The novel curing techniques result in improved low-k material properties, such as increased Young´s modulus and film hardness, as well as in dramatically reduced process times and process temperatures. This paper presents plasma and UV curing solutions for inorganic, organic and hybrid porous low-k films.
Keywords :
Young´s modulus; dielectric thin films; hardness; porous materials; UV curing; Young´s modulus; dielectric thin film; hardness; plasma curing; porous low-k material; single wafer RapidCuring; Curing; Inorganic materials; Material properties; Optical films; Organic materials; Plasma materials processing; Plasma measurements; Plasma properties; Plasma temperature; Rapid thermal processing;
Conference_Titel :
Interconnect Technology Conference, 2002. Proceedings of the IEEE 2002 International
Print_ISBN :
0-7803-7216-6
DOI :
10.1109/IITC.2002.1014941
