DocumentCode
1901064
Title
Using ASICs for component integration
Author
Nessman, Donald O. ; Rodriguez, Pedro P.
Author_Institution
Aerojet ElectroSyst., Azusa, CA, USA
fYear
1990
fDate
20-23 May 1990
Firstpage
693
Abstract
The authors examine the impact of VLSI ASICs (application-specific integrated circuits) on the use of component integration in electronic systems and show how advances in semiconductor technology affect the choice of the level of integration used in ASIC devices. The constraints and limitations on VLSI component integration are also discussed. It is shown that the optimal level of component integration can be determined for a set level of specific system goals such as cost, performance, and size. The effects of component integration are illustrated by using a simple electronic system containing memory digital ASICs, and a microprocessor on a single circuit board as an example. It is concluded that the desired level of component integration is determined through the examination of system requirements such as volume, performance, reliability, and cost goals. The level of integration is subject to technical and economic limitations on chip complexity. Limitations involving both technical and economic issues result from the constraints of process, design, assembly, and test of ASICs. In addition, consideration of the economic return on investment generally favors the use of ASICs for products produced in high volume, where the initial cost of ASIC development is small compared to the total value of the systems produced
Keywords
VLSI; application specific integrated circuits; circuit reliability; integrated circuit technology; ASICs; VLSI; chip complexity; circuit board; component integration; cost; memory; microprocessor; optimal level; performance; reliability; semiconductor technology; size; system goals; system requirements; volume; Application specific integrated circuits; Assembly; Cost function; Integrated circuit reliability; Integrated circuit technology; Microprocessors; Printed circuits; Process design; Testing; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/ECTC.1990.122265
Filename
122265
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