Title :
New polyimide for multi-chip module application
Author :
Satou, Hidetaka ; Kojima, Mitsumasa ; Makino, Daisuke ; Kikuchi, Toru ; Saito, Takeyuki
Author_Institution :
Hitachi Chem. Co. Ltd., Ibaraki, Japan
Abstract :
P-terphenyltetracarboxylic dianhydride (p-TPDA), which has a rodlike structure, has been developed as a raw material for polyimides in order to reduce the propagation delay time associated with polyimide packaging for multichip modules. The coefficient of thermal expansion (CTE) of the polyimides derived from p-TPDA is approximately 2×10 -6. This is much lower than that of conventional polyimides derived from bisphenyltetracarboxylic dianhydride (BPDA), which have a CTE of 8×10-6 K-1. Another attribute that these polyimides have is low dielectric constant, with a typical value of about 2.9. As a result, this polyimide can give improved performance when used in multichip module applications
Keywords :
modules; packaging; permittivity; polymers; thermal expansion; CTE; P-terphenyltetracarboxylic dianhydride; dielectric constant; multi-chip module application; p-TPDA; packaging; polyimides; propagation delay; rodlike structure; thermal expansion; Absorption; Chemicals; Dielectric constant; Dielectric measurements; Dielectric substrates; Polyimides; Propagation delay; Temperature; Thermal expansion; Thermomechanical processes;
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ECTC.1990.122273
