Title :
Linking technology-CAD and physical design
Author :
Halama, Stefan ; Firestone, Ram ; Talmor, Dafna ; Xun, Jianping
Author_Institution :
Technol.-CAD, Intel Corp., Santa Clara, CA, USA
Abstract :
With a focus on the software perspective, this paper examines benefits, scope, requirements, and key issues of the integration of technology-CAD with physical design. Two examples of software components for integration of TCAD with layout data are presented, and use cases are identified which result in different software requirements. Layout data volume and its relation to domain size and resolution of TCAD models is discussed, leading to the conclusion that full-chip layout processing capabilities is a key enabling component that is becoming an integral part of mainstream TCAD.
Keywords :
integrated circuit layout; technology CAD (electronics); TCAD model domain size; TCAD model resolution; full-chip layout processing; layout data volume; layout data/TCAD integration; physical design; software components; technology-CAD; Chip scale packaging; Data engineering; Decision making; Design automation; Design engineering; Educational institutions; Joining processes; Numerical analysis; Product design; Solid modeling;
Conference_Titel :
Solid-State Device Research conference, 2004. ESSDERC 2004. Proceeding of the 34th European
Print_ISBN :
0-7803-8478-4
DOI :
10.1109/ESSDER.2004.1356485