DocumentCode
1901872
Title
A new inner lead bonding scheme for tape automated bonding (TAB)
Author
Iyer, Venkat ; Pendse, Raj
Author_Institution
Nat. Semicond. Corp., Santa Clara, CA, USA
fYear
1990
fDate
20-23 May 1990
Firstpage
754
Abstract
A TAB inner-lead bonding configuration consisting of bumped tape bonded to bumped die has been developed. The concept was demonstrated on an Au-Cu metallurgy in low- and high-lead-count packages. Extensive reliability investigations were performed using low-lead-count plastic packages as test vehicles. This configuration was shown to offer distinct advantages over the more conventional planar-type bumped-die bonding configuration. The bond strengths are superior, the tape to die clearance is higher, and the reliability performance is substantially better
Keywords
circuit reliability; copper; gold; packaging; tape automated bonding; Au; Cu; bond strengths; bumped die; bumped tape; high-lead-count packages; inner lead bonding scheme; low-lead-count packages; plastic packages; reliability investigations; tape automated bonding; tape to die clearance; Assembly; Bonding; Copper; Electronics packaging; Gold; Lead compounds; Performance evaluation; Plastic packaging; Semiconductor device reliability; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/ECTC.1990.122274
Filename
122274
Link To Document